Significant optimization has been achieved on front and back sides of silicon solar cells. However, key aspects remain unoptimized, particularly cell connection fingers and the cell edges. This project addresses these challenges by replacing costly silver with copper in cell connection fingers and enhancing cell performance through innovative edge passivation techniques.

Utilizing advanced electroplating processes, we plan to transition from screen printed silver to more cost-efficient copper metallization, ensuring the establishment of diffusion barriers to prevent copper migration. Simultaneously, we aim to revolutionize edge passivation with locally maskless atomic layer deposition, minimizing recombination activity, thus boosting cell efficiency. 
The aspiration of this endeavour is to drive down the costs and elevate the efficiency of solar energy, aligning with the global sustainability agenda. Tangible objectives, including achieving comparable or better conductivity with copper metallization, successful copper diffusion prevention, and evident cell efficiency improvement, will indicate success.
Addressing these significant challenges, the project promises to make strides in the photovoltaic industry, facilitating wider adoption of renewable energy and contributing to climate change mitigation efforts. The resulting innovations and advancements will pave the way towards a sustainable future, powered by improved, cost-effective solar cells.

• Atlant3D
• ElPlatek
• DTU
• CSEM (Schweiz)