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D-shape fiber with Mach Zehnder Long-Period Gratings for a High Resolution and Selective Sensor. I
Advanced Photonics (s. BM4D.3). Optical Society of America.
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Moradi, F., Vu Cao, T., Vatajelu, E. I., Peiravi, A., Mahmoodi, H. & Wisland, D. (2013).
Domino logic designs for high-performance and leakage-tolerant applications.
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Digital Hardware Implementation of ReSuMe Learning Algorithm for Spiking Neural Networks. I
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) IEEE.
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CMOS Front End for Interfacing Spin-Hall Nano-Oscillators for Neuromorphic Computing in the GHz Range.
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2016 IEEE Symposium on VLSI Circuits, VLSI Circuits 2016: VLSI Circuits 2016 (Bind 2016). Artikel 7573559 IEEE Press.
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A System-Level Feasibility Study of a Lead-Free Ultrasonically Powered Light Delivery Implant for Optogenetics.
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A systematic review on functional electrical stimulation based rehabilitation systems for upper limb post-stroke recovery.
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Asymmetrically Doped FinFETs for Low-Power Robust SRAMs.
I E E E Transactions on Electron Devices,
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A Reduced Store/Restore Energy MRAM-Based SRAM Cell for a Non-Volatile Dynamically Reconfigurable FPGA.
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An Ultrasonically-Powered System for 1.06mm3 Implantable Optogenetics and Drug Delivery Dust.
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A novel virtual inertia control strategy for frequency regulation of islanded microgrid using two-layer multiple model predictive control.
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An Implantable Ultrasonically Powered System for Optogenetic Stimulation with Power-Efficient Active Rectifier and Charge-Reuse Capability.
IEEE Transactions on Biomedical Circuits and Systems,
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Amplification of resonant field enhancement by plasmonic lattice coupling in metallic slit arrays.
Scientific Reports,
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A Low-Power High-Speed Spintronics-Based Neuromorphic Computing System Using Real-Time Tracking Method.
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A low-noise high-linear wide dynamic-range MTJ-based magnetic field sensor. I
2023 IEEE Nordic Circuits and Systems Conference (NorCAS) IEEE.
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A Low-Noise High Input Impedance Analog Front-End Design for Neural Recording Implant. I
2019 26th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2019 (s. 887-890). Artikel 8964899 IEEE.
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